Nacházíte se: Domů » Terminologická databáze » ČSN P CEN ISO/TS 80004-8 - commnition

ČSN P CEN ISO/TS 80004-8 - Nanotechnologie - Slovník - Část 8: Procesy nanovýroby

Stáhnout normu:	ČSN P CEN ISO/TS 80004-8 (Zobrazit podrobnosti) Zákazníci, kteří mají na svém počítači sjednanou od České agentury pro standardizaci (ČAS) službu ČSN on-line pro elektronický přístup do plných textů norem v pdf (verzi pro firmy nebo pro jednotlivce), mohou zde přímo otevírat citované ČSN.
Datum vydání/vložení:	2016-11-01
Zdroj:	https://www.iso.org/obp/ui/#iso:std:iso:ts:80004:-8:ed-1:v1:en
Třidící znak:	012003
ICS:	01.040.07 - Matematika. Přírodní vědy (názvosloví) 07.120 - Nanotechnologie
Stav:	Neplatná

2.1 carbon nanotube CNT
2.2 nanocomposite
2.3 nanofibre
2.4 nanomaterial
2.5 nano-object
2.6 nanoparticle
2.7 nanoscale
2.8 nanostructured material
2.9 nanotube
3 General terms
3.1 bottom up nanomanufacturing
3.2 co-deposition
3.3 commnition
3.4 directed assembly
3.5 directed self-assembly
3.6 lithography
3.7 multilayer deposition
3.8 nanofabrication
3.9 nanomanufacturing
3.10 nanomanufacturing process
3.11 self-assembly
3.12 surface functionalization
3.13 top-down nanomanufacturing
4 Directed assembly
4.1 electrostatic driven assembly
4.2 fluidic alignment
4.3 hierarchical assembly
4.4 magnetic driven assembly
4.5 shape-based assembly
4.6 supramolecular assembly
4.7 surface-to-surface transfer
5 Self-assembly processes
5.1 colloidal crystallization
5.2 graphioepitaxy
5.3 ion beam surface reconstruction
5.4 Langmuir-Blodgett film formativ
5.5 Langmuir-Blodgett film transfer
5.6 layer-by-layer deposition LbL deposition
5.7 modulated elemental reactant method
5.8 self-assembled monolayer formation SAM formation
5.9 Stranski-Krastanow growth
6 Synthesis
6.1 Gas process phase – Physical methods
6.1.1 cold gas dynamic spraying
6.1.2 electron-beam evaporation
6.1.3 Electro-spark deposition processes
6.1.3.1 electro-spark deposition
6.1.4 Spray drying processes
6.1.4.1 freeze drying
6.1.4.2 spray drying
6.1.5 supercritical expansit
6.1.6 suspension combustion thermal spray
6.1.7 wire electric explosiv
6.1.8 vaporization
6.2 Gas process phase – Chemical methods
6.2.1 Flame synthesis processes
6.2.1.1 liquid precursor combustion
6.2.1.2 plasma spray
6.2.1.3 pyrogenesis
6.2.1.4 solution precursor plasma spray
6.2.1.5 thermal spray pyrolysis
6.2.2 hot wall tubular reaction
6.2.3 photothermal synthesis
6.2.4 vapour-liquid-solid nanofibre synthesis VLS
6.3 Liquid process phase – Physical methods
6.3.1 electrospinning
6.3.2 in-situ intercalative polymerization
6.3.3 nanoparticle dispersion
6.3.5 tape casting
6.3.6 wet ball milling
6.4 Liquid process phase – Chemical methods
6.4.1 acid hydrolysis of celulose
6.4.2 nanoparticle precipitation
6.4.3 prompt inorganic condensation
6.4.4 reverse micelle process
6.4.5 sol-gel processing
6.4.6 surfactant templating
6.4.7 Stober process
6.5 Solid process phase – Physical methods
6.5.1 Block copolymer processes
6.5.1.1 block copolymer phase segregation
6.5.1.2 block copolymer templating
6.5.2 clay dispersion
6.5.3 cold dressing
6.5.4 conshearing continuous confined strip sparing C2S2
6.5.5 devitrification
6.5.6 grinding
6.5.7 high-speed micromachining
6.5.8 ion implantation
6.5.9 Milling processes
6.5.9.1 cryogenic milling
6.5.9.2 dry ball milling
6.5.10 multi-pass chin forging
6.5.11 nanotemplated growth
6.5.12 polymer nanoparticle dispersion
6.5.13 Sintering processes
6.5.13.1 hot dressing
6.5.13.2 nanoparticle sintering
6.5.13.3 spark plasma sintering
6.6 Solid process phase – Chemical methods
6.6.1 block copolymer chemici derivatization
6.6.2 electrochemical anodization
6.6.3 intercalation
6.6.4 two-phase methods
7 Fabrication
7.1 Nanopatterning lithography
7.1.1 3D lithography
7.1.2 additive processing
7.1.3 block copolymer lithography
7.1.4 colloidal crystal template lithography
7.1.5 deep ultraviolet lithography DUV
7.1.6 dip-pen nanolithography
7.1.7 electron-beam lithography
7.1.8 extreme ultraviolet lithography EUV
7.1.9 focused ion-beam lithography FIB
7.1.10 immersion optics
7.1.11 interference lithography
7.1.12 ion induced deposition
7.1.13 ion induced etching
7.1.14 ion projection lithography
7.1.15 micro-contact printing
7.1.16 microfluidic deposition
7.1.17 nano-embossing
7.1.18 nano-imprint lithography NIL
7.1.19 natural lithography
7.1.20 photolithography optical lithography
7.1.21 phase-contrast photolithography
7.1.22 plasmonic lithography
7.1.23 scanning force probe writing
7.1.24 scanning tunnelling microscope chemical vapour deposition STM CVD
7.1.25 soft lithography
7.1.27 subtractive processing
7.1.28 x-ray lithography
7.2 Deposition processes
7.2.1 adsorption
7.2.2 atomic layer deposition ALD
7.2.3 chemical vapour deposition CVD
7.2.4 catalytic chemical vapour deposition CCVD
7.2.5 cluster beam rating
7.2.6 dip rating
7.2.7 electrodeposition electroplating
7.2.8 electroless deposition
7.2.9 electro-spray
7.2.10 evaporation
7.2.11 focused electron-beam deposition
7.2.12 focused ion-beam depositionFIB
7.2.13 molecular beam epitaxy
7.2.14 physical vapour deposition PVD
7.2.15 polyelectrolyte layer-by-layer LbL
7.2.16 thermal spray
7.2.17 spin coating
7.2.18 spray deposition
7.2.19 sputter deposition
7.2.20 surface polymerization
7.3 Etching processes
7.3.1 anisotropic etching
7.3.2 Bosch etching
7.3.3 chemical etching
7.3.4 chemically assisted ion beam etching
7.3.5 cryogenic etching
7.3.6 crystallographic etching
7.3.7 deep reactive ion etching DRIE
7.3.8 dry-ashing
7.3.9 dry-etching
7.3.10 focused ion-beam etching FIB
7.3.11 high-density plasma etching
7.3.12 inductive coupled plasma ICP
7.3.13 ion beam etching ion beam milling
7.3.14 isotropic etching
7.3.15 laser ablation
7.3.16 light-assisted etching photochemical etching
7.3.17 physical etching sputter etching
7.3.18 plasma etching
7.3.19 radiation track etching
7.3.20 reactive ion etching RIE
7.3.21 selective etching
7.3.22 wet etching
7.4 Printing and coating
7.4.1 embossing imprinting
7.4.2 multilayer film process
7.4.3 nanofibre precipitation
7.4.4 nanoparticle spray rating

Terminologie normy

‹

Nahlásit chybu

3.3 commnition

crushing or grinding for particle size reduction

3.3 rozmělňování

drcení nebo rozbrušování pro snížení velikosti částice