ČSN P CEN ISO/TS 80004-8 - Nanotechnologie - Slovník - Část 8: Procesy nanovýroby
| Stáhnout normu: | ČSN P CEN ISO/TS 80004-8 (Zobrazit podrobnosti) Zákazníci, kteří mají na svém počítači sjednanou od České agentury pro standardizaci (ČAS) službu ČSN on-line pro elektronický přístup do plných textů norem v pdf (verzi pro firmy nebo pro jednotlivce), mohou zde přímo otevírat citované ČSN. |
| Datum vydání/vložení: | 2016-11-01 |
| Zdroj: | https://www.iso.org/obp/ui/#iso:std:iso:ts:80004:-8:ed-1:v1:en |
| Třidící znak: | 012003 |
| ICS: |
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| Stav: | Neplatná |
- 2.1 carbon nanotube CNT
- 2.2 nanocomposite
- 2.3 nanofibre
- 2.4 nanomaterial
- 2.5 nano-object
- 2.6 nanoparticle
- 2.7 nanoscale
- 2.8 nanostructured material
- 2.9 nanotube
- 3 General terms
- 3.1 bottom up nanomanufacturing
- 3.2 co-deposition
- 3.3 commnition
- 3.4 directed assembly
- 3.5 directed self-assembly
- 3.6 lithography
- 3.7 multilayer deposition
- 3.8 nanofabrication
- 3.9 nanomanufacturing
- 3.10 nanomanufacturing process
- 3.11 self-assembly
- 3.12 surface functionalization
- 3.13 top-down nanomanufacturing
- 4 Directed assembly
- 4.1 electrostatic driven assembly
- 4.2 fluidic alignment
- 4.3 hierarchical assembly
- 4.4 magnetic driven assembly
- 4.5 shape-based assembly
- 4.6 supramolecular assembly
- 4.7 surface-to-surface transfer
- 5 Self-assembly processes
- 5.1 colloidal crystallization
- 5.2 graphioepitaxy
- 5.3 ion beam surface reconstruction
- 5.4 Langmuir-Blodgett film formativ
- 5.5 Langmuir-Blodgett film transfer
- 5.6 layer-by-layer deposition LbL deposition
- 5.7 modulated elemental reactant method
- 5.8 self-assembled monolayer formation SAM formation
- 5.9 Stranski-Krastanow growth
- 6 Synthesis
- 6.1 Gas process phase – Physical methods
- 6.1.1 cold gas dynamic spraying
- 6.1.2 electron-beam evaporation
- 6.1.3 Electro-spark deposition processes
- 6.1.3.1 electro-spark deposition
- 6.1.4 Spray drying processes
- 6.1.4.1 freeze drying
- 6.1.4.2 spray drying
- 6.1.5 supercritical expansit
- 6.1.6 suspension combustion thermal spray
- 6.1.7 wire electric explosiv
- 6.1.8 vaporization
- 6.2 Gas process phase – Chemical methods
- 6.2.1 Flame synthesis processes
- 6.2.1.1 liquid precursor combustion
- 6.2.1.2 plasma spray
- 6.2.1.3 pyrogenesis
- 6.2.1.4 solution precursor plasma spray
- 6.2.1.5 thermal spray pyrolysis
- 6.2.2 hot wall tubular reaction
- 6.2.3 photothermal synthesis
- 6.2.4 vapour-liquid-solid nanofibre synthesis VLS
- 6.3 Liquid process phase – Physical methods
- 6.3.1 electrospinning
- 6.3.2 in-situ intercalative polymerization
- 6.3.3 nanoparticle dispersion
- 6.3.5 tape casting
- 6.3.6 wet ball milling
- 6.4 Liquid process phase – Chemical methods
- 6.4.1 acid hydrolysis of celulose
- 6.4.2 nanoparticle precipitation
- 6.4.3 prompt inorganic condensation
- 6.4.4 reverse micelle process
- 6.4.5 sol-gel processing
- 6.4.6 surfactant templating
- 6.4.7 Stober process
- 6.5 Solid process phase – Physical methods
- 6.5.1 Block copolymer processes
- 6.5.1.1 block copolymer phase segregation
- 6.5.1.2 block copolymer templating
- 6.5.2 clay dispersion
- 6.5.3 cold dressing
- 6.5.4 conshearing continuous confined strip sparing C2S2
- 6.5.5 devitrification
- 6.5.6 grinding
- 6.5.7 high-speed micromachining
- 6.5.8 ion implantation
- 6.5.9 Milling processes
- 6.5.9.1 cryogenic milling
- 6.5.9.2 dry ball milling
- 6.5.10 multi-pass chin forging
- 6.5.11 nanotemplated growth
- 6.5.12 polymer nanoparticle dispersion
- 6.5.13 Sintering processes
- 6.5.13.1 hot dressing
- 6.5.13.2 nanoparticle sintering
- 6.5.13.3 spark plasma sintering
- 6.6 Solid process phase – Chemical methods
- 6.6.1 block copolymer chemici derivatization
- 6.6.2 electrochemical anodization
- 6.6.3 intercalation
- 6.6.4 two-phase methods
- 7 Fabrication
- 7.1 Nanopatterning lithography
- 7.1.1 3D lithography
- 7.1.2 additive processing
- 7.1.3 block copolymer lithography
- 7.1.4 colloidal crystal template lithography
- 7.1.5 deep ultraviolet lithography DUV
- 7.1.6 dip-pen nanolithography
- 7.1.7 electron-beam lithography
- 7.1.8 extreme ultraviolet lithography EUV
- 7.1.9 focused ion-beam lithography FIB
- 7.1.10 immersion optics
- 7.1.11 interference lithography
- 7.1.12 ion induced deposition
- 7.1.13 ion induced etching
- 7.1.14 ion projection lithography
- 7.1.15 micro-contact printing
- 7.1.16 microfluidic deposition
- 7.1.17 nano-embossing
- 7.1.18 nano-imprint lithography NIL
- 7.1.19 natural lithography
- 7.1.20 photolithography optical lithography
- 7.1.21 phase-contrast photolithography
- 7.1.22 plasmonic lithography
- 7.1.23 scanning force probe writing
- 7.1.24 scanning tunnelling microscope chemical vapour deposition STM CVD
- 7.1.25 soft lithography
- 7.1.27 subtractive processing
- 7.1.28 x-ray lithography
- 7.2 Deposition processes
- 7.2.1 adsorption
- 7.2.2 atomic layer deposition ALD
- 7.2.3 chemical vapour deposition CVD
- 7.2.4 catalytic chemical vapour deposition CCVD
- 7.2.5 cluster beam rating
- 7.2.6 dip rating
- 7.2.7 electrodeposition electroplating
- 7.2.8 electroless deposition
- 7.2.9 electro-spray
- 7.2.10 evaporation
- 7.2.11 focused electron-beam deposition
- 7.2.12 focused ion-beam depositionFIB
- 7.2.13 molecular beam epitaxy
- 7.2.14 physical vapour deposition PVD
- 7.2.15 polyelectrolyte layer-by-layer LbL
- 7.2.16 thermal spray
- 7.2.17 spin coating
- 7.2.18 spray deposition
- 7.2.19 sputter deposition
- 7.2.20 surface polymerization
- 7.3 Etching processes
- 7.3.1 anisotropic etching
- 7.3.2 Bosch etching
- 7.3.3 chemical etching
- 7.3.4 chemically assisted ion beam etching
- 7.3.5 cryogenic etching
- 7.3.6 crystallographic etching
- 7.3.7 deep reactive ion etching DRIE
- 7.3.8 dry-ashing
- 7.3.9 dry-etching
- 7.3.10 focused ion-beam etching FIB
- 7.3.11 high-density plasma etching
- 7.3.12 inductive coupled plasma ICP
- 7.3.13 ion beam etching ion beam milling
- 7.3.14 isotropic etching
- 7.3.15 laser ablation
- 7.3.16 light-assisted etching photochemical etching
- 7.3.17 physical etching sputter etching
- 7.3.18 plasma etching
- 7.3.19 radiation track etching
- 7.3.20 reactive ion etching RIE
- 7.3.21 selective etching
- 7.3.22 wet etching
- 7.4 Printing and coating
- 7.4.1 embossing imprinting
- 7.4.2 multilayer film process
- 7.4.3 nanofibre precipitation
- 7.4.4 nanoparticle spray rating
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7 Fabrication